minimizeApplications

 

» print page

Thermal Management

ThermalManagement-Chip.jpg
Current trends in the high reliability electronics sector are the continued miniturisation of parts whilst increasing their performance.

To attain this goal, new materials and technologies have to be developed such as the semiconductors GaN and SiC, or the silver sinter process as an alternative to conventional soldering.

These new technologies place higher thermal demands on the components as the operating temperatures of the new setups can be higher, resulting in localised hotspots.

The increased surrounding and component temperatures, in addition to the constant thermal cycling, can lead to reduced life times if the wrong materials are selected.

The use of appropriate high-tech materials prevents such burdens and guarantees a rapid and safe removal of heat from the components via its high thermal capabilities.

| Aluminium Graphite-based Parts

Aluminium Graphite-based Parts

  » proceed

minimizeMaterials (1)

minimizeMultimedia (0) 

maximizeDialog board