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Electronic Packaging

Packaging of electronic components is a broad field in which numerous different technologies have been established until the present day. Basically, the idea is to move the protection of a sensitive electronic component away from the packaging and to firmly integrate it on the component itself. Packaging can be carried out on individual components or on entire products.

To that end, almost all conceivable materials can be used: metals, plastics, liquids, glass and ceramic materials. In developing a suitable packaging the engineers frequently have to weigh the possible external influences against the material properties: mechanical influences, changing weather conditions, dust, electromagnetic influences or extreme heat constitute one aspect, whereas safety-relevant and aesthetic requirements form the other aspect to be considered.

In this area of tension in particular low melting glasses which provide an air-tight cover with good electric insulation and with a good form-fit have proved to be suitable. For automatic housing of the components, these are put in moulds by a machine and subsequently covered with a glass melt. In this process, the moulds have to ensure a high positioning precision and narrow tolerances. For this reason, graphite bottom dies are frequently used for glass-metal leadthroughs since these are hardly covered by the glass melt, do not react with the glass or the metallic component and do not tend to warp on account of its low heat expansion – even after many temperature cycles.

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